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Temperature Chambers

Life test cycling of temperature accelerating electronic degradation.

See Also: Environmental Chambers, Chambers, Humidity Chambers


Showing results: 286 - 300 of 346 items found.

  • FLASH Memory Endurance Cycling Systems

    NTS3700 Series - Novtek Test Systems

    FLASH memory endurance cycling systems are used to characterize and qualify the write/erase cycling endurance of FLASH memory devices, and to conduct functional testing of memory devices at extreme temperatures. A typical system consists of an environmental chamber, algorithmic pattern generator, programmable power supplies and system controller.Novtek’s systems can accommodate from 64 to 864 devices for parallel devices and . In addition to FLASH, the systems can also accommodate MRAM, EEPROM, EPROM, PROM (OUM), Mask ROM, SRAM, FeRAM, DRAM, PC Cards (PCMCIA), embedded FLASH microcontrollers and NVM based FPGA. The system's environmental chamber has a range of -55oC to +200oC and is ideal for temperature characterization of memory based devices and packages.

  • Data Acquisition and Reduction

    STI Technologies, Inc.

    STI offers custom virtual instrument design with LABVIEW software and National Instruments data aquisition cards. Calibration systems include shock accelerometer calibration based on Hopkinson bar, transverse sensitivity, calibration of accelerometers at various temperatures (includes environmental chamber temperature control, shaker motion control, data acquisition and processing) as well as data aquisition and processing systems for turbomachinery and general vibration applications.

  • Multi Channel Optical Fibre Verification

    LXinstruments GmbH

    The multi-channel optical fibre test system is used in the development and qualification of single mode optical fibres. The fibres are exposed to environmental influences in a climatic chamber in order to analyse the data on insertion loss and reflection. In addition, the current temperature in the climatic chamber is documented. Insertion loss measurement is performed with the help of an optical power meter, laser sources and optical switches. An Optical Time Domain Reflectometer (OTDR) from Exfo is used for the reflection measurements. The system was designed for the simultaneous characterization of 15 sample fibres and one reference fibre.

  • Thermal Shock Environmental Test Chamber

    Guangdong Bell Experiment Equipment Co.,Ltd

    DGBell’s Thermal Shock Chamber provide the sudden temperature changes between extreme cold and extreme hot from -65℃ to 150℃ (customized available), specially for environmental stress screen test of the industries that rely on thermal testing, such as component, board electronic assemblies, defense, material stress, consumer products etc.  The thermal shock test can cause faulting or cracking by the expansion and contraction on the products, indicates the hidden manufacturing defects. Bell’s Thermal Shock Chamber ensure you to launch qualified product to the market.

  • Temperature Humidity Logger

    IM3700 Series - Ajinkya Electronic Systems

    We offer IM3700 Series Temperature / Humidity Loggers that are highly versatile monitoring & recording units. These can accept input from different type of humidity sensors as well as RTD sensor for Dry Bulb / Wet Bulb measurement technique. Moreover, these loggers can be used for monitoring of clean rooms, green rooms, server rooms, storage rooms & environment chambers in various industries, such as pharmaceutical, textile, cement, & logistics.

  • High Temperature Un-Cooled Extensometers (700 C)

    Model 7642 - Jinan Testing Equipment IE Corporation

    These extensometers use a high-temperature capacitive sensor and do not require any cooling. They will operate up to the maximum temperature limit of most environmental chambers used in materials testing. The Model 7642 is ideal for testing composites, metals and high temperature polymers in tensile, compression or cyclic testing. All units can be displaced in both compression and tension. The extensometer is supplied with the advanced DT6229 controller. The standard output is 0-10VDC analog signal, factory calibrated with the extensometer. This system provides a number of functional enhancements, including high speed digital output, built in calibration and tare functions, analog and digital filters, and more.

  • Mid-Range Gas Filter Correlation CO2 Analyzer

    Model N360M - Teledyne Advanced Pollution Instrumentation

    The Model N360M measures carbon dioxide (CO2) by comparing infrared energy absorbed by a sample to that absorbed by a reference according to the Beer-Lambert law.The N360M uses Gas Filter Correlation (GFC) to overcome the interfering effects of various other gases (such as water vapor) that also absorb IR. The analyzer passes the IR beam through a spinning wheel made up of two separate chambers: one containing a high concentration of CO2 known as the reference, and the other containing a neutral gas known as the measure. The concentration of CO2 in the sample chamber is computed by taking the ratio of the instantaneous measure and reference values and then compensating the ratio for sample temperature and pressure. A nitrogen purge system is provided for the GFC wheel assembly to eliminate the eff​ects of ambient CO2, if necessary.

  • Gas Filter Correlation CO2 Analyzer

    ​Model N360 - Teledyne Advanced Pollution Instrumentation

    The Model N360 measures carbon dioxide (CO2) by comparing infrared energy absorbed by a sample to that absorbed by a reference according to the Beer-Lambert law.The N360 uses Gas Filter Correlation (GFC) to overcome the interfering effects of various other gases (such as water vapor) that also absorb IR. The analyzer passes the IR beam through a spinning wheel made up of two separate chambers: one containing a high concentration of CO2 known as the reference, and the other containing a neutral gas known as the measure. The concentration of CO2 in the sample chamber is computed by taking the ratio of the instantaneous measure and reference values and then compensating the ratio for sample temperature and pressure. A nitrogen purge system is provided for the GFC wheel assembly to eliminate the eff​ects of ambient CO2, if necessary.

  • Walk in Chamber for Altitude Simulated Test

    Guangdong Bell Experiment Equipment Co.,Ltd

    Walk in Chamber for Altitude Simulated Test Relative Standard test requirementsTest Object: battery pack and systemTest Conditions: Altitude 4000m or the equate air pressure condition, atroom temperature.The test objects stay in the test condition as Item 2 for 5 hours.Subject the test object to 1C(no more than 400A) constant current discharge until reaching the cutoff condition.After testing, observe for 2h under the room temperature.

  • IP X5, X6 - Walk-In Rain Test Chamber

    ACMAS Technologies Pvt. Ltd.

    WEIBER designs and manufactures standard as well as customized water spray test chamber for evaluating various automotive, electrical and electronics items under water, rain or shower conditions. The chamber interrogates the performance of parts when subjected to water droplets.The system is based on the IP X5, X6 specification requirements, and can also accomplish individual automaker’s tests, as well as electrical-enclosure tests.Our system uses multiple control solenoids to vary the water's spray volume/pressure. A holding tank prepares the water to the desired temperature, if required. A pump ensures the water is delivered in the proper pressure range.

  • Wafer Bonder

    AML - OAI

    Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.

  • Compact TLP/VF-TLP/HMM Probearm Set for Temperature Measurements

    PHD-4001A - High Power Pulse Instruments GmbH

    *Electrically isolated probearm kit for VF-TLP, TLP, HMM, HBM force and sense probingbased on the GGB Picoprobe Model 10 replacement probe tips*Buried coaxial cable channel for thermo-chuck in isolated chamber temperature measurements*Compatible with GGB Picoprobe Model 10 replacement probetips*Compatible with all standard micropositioner interfaces*High precision rotation of the probearm by backlash-free 80:1 gear*Rugged stainless steel design*SMA connectors

  • Environmental Testing

    dB Technology Ltd.

    We have a CTS C-65/100 Climatic Test Chamber available for hire at dB Technology.They have available:*Internal dimensions: 500 x 500 x 400mm (w x h x d)*Temperature range: -65°C to +180°C*Heating rate: 3°C/min*Cooling rate: 2°C/min*Climatic temp range: +10°C to +95°C*Humidity Range: 10 to 98% RH

  • Magnetic System

    NMR-EA300 System - Caylar

    The NMR-EA300 system is the reference for calibrating magnetic sensors. It allows to generate an absolute magnetic field at <±10mG (0.1 uT) without temperature drift (<0.1ppm/C°) over a range from 14mT to 3T. This system is composed of an EA300 electromagnet with NMR poles, a MPU-16U ±150A ±70V current source of class 1ppm and a NMR20 Teslameter with a magnetic field controller (FR020).A thermostat chamber can be installed in the air gap (Optionally available on 50mm and 70mm gap poles).

  • Halt Hass Chambers

    ACMAS Technologies Pvt. Ltd.

    HALT and HASS chambers from WEIBER provide extreme temperature & vibration capabilities used during the product design and manufacturing cycles to compress the time normally required to identify design and process weaknesses. HALT techniques are important in uncovering many of the weak links inherent to the design and fabrication process of a new product. HASS techniques are incorporated during the production phase to find manufacturing process defects that could cause product failures in the field.

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